Joe Rauschmayer is senior vice president for Spansion’s Wafer Fabrication Operations, Corporate Quality and Product Engineering functions, charged with leading the company’s internal and external wafer fabrication operations, bringing new products to market, managing cost controls of existing products and ensuring product quality and reliability.
Rauschmayer brings 29 years of expertise to Spansion. Prior to his current role, he served as the corporate vice president of engineering in Spansion’s Wireless Solution Division, with responsibility for product engineering, product development, test engineering and corporate test technology. Previously, he led the engineering team in the Consumer, Set Top Box & Industrial Division, where he was responsible for overseeing product engineering, product development, test engineering and system engineering. Prior to Spansion, Rauschmayer spent 14 years at AMD as part of the non-volatile memory team, starting out in product engineering, holding roles as product line director and vice president of product line engineering for the Memory Group, where he developed a systematic approach to yield enhancement that has been transferred to many of Spansion Inc.’s processes. Rauschmayer led efforts that drove AMD into the automotive Flash marketplace, acting as the executive sponsor for the implementation phase of QS9000 (now known as TS16949), the American Auto Industry Quality System Standard.
Rauschmayer has also served as senior vice president of Operations and corporate officer of Sipex, an analog semiconductor company.
Rauschmayer holds a bachelor’s degree in electrical engineering from Wilkes College in Pennsylvania and a master’s degree in electrical engineering from Ohio University.