Die & Wafer NOR Flash Memory
Spansion is the ideal source for high performance and reliable bare die products for custom SIP (System-in-Package) or Multi-Chip Package (MCP) solutions requiring Flash memory. Applications such as portable consumer electronics and mobile phones often require small form-factors where designers reduce the size of their printed circuit boards by combining multiple functions of electronic systems into a single, vertically stacked or multi-chip package. Some other applications, such as automotive products, need to sustain extreme hot and cold temperatures for extended periods of ten years or longer. Spansion automotive under-the-hood bare die products can sustain operating temperatures as high as 150°C.
Despite the benefit at the end applications, these complex package techniques are often challenging in terms of fabrication, yield and end product reliability. Having high-quality die products and working with experienced bare die suppliers are essential for the success of SIP and MCP design and manufacturing. Spansion die and wafer products enable SIPs and MCPs to meet these tough standards.
Leveraging from its extensive experience from providing Known Good Die (KGD) products to the most demanding application segments, such as automotive and defense, Spansion is now introducing an expanded die and wafer business to the general market. Spansion’s KGD products adhere to the rigorous EIAJ EDR-4703 standard. KGD and wafer products are submitted to extensive inspections for visual and mechanical defects and wafer level testing, including additional high temperature screening on quality and reliability defects to ensure bare die products offer the same level of performance and reliability as packaged parts. As a result, our customers benefit from reduced SIP manufacturing yield loss and flash memory related product reliability issues.
Spansion is now shipping die products in either surf tape for production, or waffle pack for samples, and wafer products in wafer jar. For customer convenience, SIP and/or MCP assembly processes, Spansion can also provide wafer backgrind service. Spansion offers five standard thicknesses for bare die products: 785um or 725um, 500um, 280um and 200um. Custom die thickness can be developed with non-recurring engineering fees. With a focus on being a superior die product supplier and long term partner, Spansion is also tapping into our extensive MCP product expertise to offer SIP and MCP package and substrate design recommendations on our flash products and MCP assembly and testing consultation.