Multi-Chip-Package (MCP) Solutions

Spansion® multi-chip-package solutions enable feature-rich applications in space-constrained designs by combining high-performance Spansion Flash memory and other high-quality memory devices into a single, small, and consistent footprint.

Spansion MCP solutions are ideal for a variety of applications requiring high performance, low power consumption, and a small footprint:

• Wireless modems
• Cellular handsets
• Personal information devices
• Handheld PCs
• GPS receivers

Small Footprint, Consistent Packaging

Cellular handset designers and other leading manufacturers face many challenges providing the latest features in decreasing footprints. Spansion MCP devices meet these challenges by offering a single, space-saving package with the performance and quality that customers expect from Spansion products.

Because the various Spansion MCP solutions are stacked in a consistent footprint and pinout, customers can easily design a single-board while differentiating their products. In addition, the advanced stacking technology utilized can readily be applied to new Flash, SDRAM, or other devices as they are introduced.

Streamline the Supply Chain

As a high volume consumer of SRAMs and pSRAMs for integration into MCPs, Spansion can secure supply at reduced prices and pass on those savings to customers. In addition, we manage the complex logistics, quality and inventory management issues that can arsie when procuring memory, thereby enabling customers to streamline their supply chain.