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Universal Footprint for NOR Flash, Serial Flash, SPI Flash, and NAND Flash




 

Consistent Packages and Pinouts Speeds Time-To-Market and Reduces Design Costs

Spansion’s Universal Footprint with consistent packaging and pinouts across product families, process technologies and densities allows design engineers to swap devices at any point in the design or product life cycle without affecting board design.

Designers can manage differentiated end product models based on a single platform design thanks to Spansion’s Universal Footprint. The platform design concept, used by makers of DVD players, industrial equipment, and network routers, saves design time and minimizes cost. Coupled with our cost-effective system software and drivers, you have a complete Flash solution to manage the changing needs of your products.

Leveraging the Spansion Universal Footprint


Time-To-Market

  • Minimize board rework and re-spin

 

Price

  • Interoperable between high performance and price-performance products to optimize BOM

 

Supply Chain

  • Service multiple platforms with one footprint
  • Minimize reliance on one product by qualifying multiple products in the same footprint

 

  

The 56-pin TSOP package is a superset of the 48-pin TSOP. Both packages feature the same 48-pin core with consistent addressing, enabling board designs supporting densities from 2Mb to 1Gb.

 
  48-pin and 56-pin TSOP
  For extreme design flexibility 2Mb - 1Gb