Spansion
Solutions
Technology
Products
Support
About Us
Skip Navigation LinksSpansion > Support > Lead-Free Packaging

Lead-Free Packages from Spansion®

Overview

Lead in semiconductor products has come under increased environmental scrutiny because of the growing number of electronic products requiring end-of-life treatment and disposal.

Spansion® is strongly committed to reducing lead in the environment through the use of lead-free packaging materials for Flash memory devices. Most importantly, the quality and reliability standards for Spansion lead-free packages are identical to those for current SnPb packages.

Legislative Policies

A variety of jurisdictions around the globe have proposed regulations that would restrict the use of lead or impose additional requirements when lead is used in products. For example, the European Community has established a phase-out date of July 1, 2006 for lead in electronic products, with some exceptions.

Click here for more information on the Directive of the European Parliament and of the Council on the restriction of the use of certain hazardous substances in electrical and electronic equipment.

  Customer Notice
Some FBGA-packaged product lines and part numbers may not be available from Spansion for import or sale into the United States prior to September 24, 2010 because of an order from the United States International Trade Commission. Please check with your Spansion sales representative or distributor for more details regarding product availability in the U.S.
 
 
Materials Declaration Sheets
Analytical Data
Lead-free Migration OPN Guide

© 2010 Spansion Inc.Terms of Use | Privacy Policy | Best Viewed | Investor Relations