Skip Ribbon Commands
Skip to main content
Navigate Up
Sign In

Lead-Free Packaging

:

Lead-free Packaging for NOR Flash, Serial Flash, SPI Flash, NAND Flash




 

Support Header
Lead-Free Packages from Spansion®

Overview

Lead in semiconductor products has come under increased environmental scrutiny because of the growing number of electronic products requiring end-of-life treatment and disposal.

Spansion® is strongly committed to reducing lead in the environment through the use of lead-free packaging materials for Flash memory devices. Most importantly, the quality and reliability standards for Spansion lead-free packages are identical to those for SnPb packages.

Legislative Policies

A variety of jurisdictions around the globe have proposed regulations that would restrict the use of lead or impose additional requirements when lead is used in products. For example, the European Community has established a phase-out date of July 1, 2006 for lead in electronic products, with some exceptions.

Click here for more information on the Directive of the European Parliament and of the Council on the restriction of the use of certain hazardous substances in electrical and electronic equipment.

Materials Declaration Sheets
Analytical Data