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Burst-mode and page-mode interface Multi-Chip-Package (MCP) Solutions |
Known Good Die ProductsSpansion has a long history of providing Known Good Die (KGD) products to the marketplace, servicing some of the most demanding applications like automotive under-the-hood. Spansion has a tradition of delivering quality products for a wide range of applications, while remaining flexible in responding to customer needs. Known Good Die products are tested, bare, unpackaged Flash memory. KGDs are in high demand as designers try to reduce the size of their boards. These products are commonly used in packaging solutions requiring Flash memory including multi-chip and package-on-package options for baseband applications, mobile graphics and FPGA/ASICs. Spansion’s KGD program is comprehensive and complete. The products are submitted to rigorous testing, including three wafer sorts to help ensure excellent quality. KGD products offer the same level of performance and reliability as packaged parts. |
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