Innovative Package-on-Package (PoP) Technology From Spansion®

Package-on-Package (PoP) is the latest packaging innovation designed to vertically combine discrete logic and memory Ball Grid Array (BGA) packages. Two packages rest on top of one another, with a standard interface to route signals between them.

Multi-Chip Packages (MCPs) stack memory components into a package. PoP products go one step further than MCPs by stacking the memory subsystem on top of the logic package for greater space savings on the PCB.

As next-generation wireless devices incorporate more features and require more memory, mobile device makers attempt to maintain the same form factor. Space savings becomes increasingly important. Therefore, PoP is an ideal packaging solution for mobile handset applications, as well as digital cameras, PDAs and MP3 players.

In addition to space savings, PoP enables greater flexibility during system design. Memory and logic packages can be easily combined based on system design needs, potentially reducing inventory and lowering cost. Simpler signal routing and reduced pin-count can improve signal integrity and reduce the complexity of the PCB layout. Because PoP can enable shorter signal delays and increased memory access speeds the system may be able to recognize a performance improvement.

PoP solutions therefore enable board space savings, simplified system design, enhanced performance, and lower pin count.

Top Package: Spansion® Flash Memory

Bottom Package: Logic from a Mobile Chipset Partner

Learn More about PoP

Take the next step toward using our innovative NOR Flash memory solutions. To learn more and to request PoP samples, contact your local sales representative.