Analytical Data

The following table presents analytical reports from our manufacturers showing compliance with RoHS.

Leadframe Packages

• Die: Spansion
• Die Attach: AB8340
• Bonding (gold) Wire:
     K&S
     MEM
     Tanaka
• Leadframe: Alloy CDA 194
• Mold Compound: EME-G700L
• External Plating:
     Matte Sn
     SnPb (15% Pb)

FBGA Packages (single die packages)

• Die: Spansion
• Die Attach: QMI 546
• Bonding (gold) Wire:
     K&S
     MEM
     Tanaka
• Substrate Material (procured from various suppliers) are :
     Mitsubishi GC HL-832HS (contains halogens)
     Mitsubishi GC HL-832NXA (low halogen content, OSP pad finish)
     Mitsubishi GC HL-832NXA (low halogen content, Ni-Au pad finish)
• Mold Compound: Hitachi CEL 9200ZHF10
• Solder Spheres: NMC
     SAC 105
     SAC 125
     SAC 305
     SnPb

FBGA Packages (multi die packages)

• Die: Spansion
• Die Attach:
     QMI 546
     HS-230
     FH 900
     FH WP-117
• Bonding (gold) Wire:
     K&S
     MEM
     Tanaka
• Substrate Material (procured from various suppliers) are:
     Mitsubishi GC HL-832HS (contains halogens)
     Mitsubishi GC HL-832NXA (low halogen content, OSP pad finish)
     Mitsubishi GC HL-832NXA (low halogen content, Ni-Au pad finish)
• Mold Compound: Shin-Etsu KMC-3580LVA
• Solder Spheres: NMC
     SAC 105
     SAC 125
     SAC 305
     SnPb