Green and Non-Pb Flash Memory Product FAQ

Green Flash Memory Products

1. Is there a standard definition of "green?"
2. Are Spansion products "Energy Star" compliant?
3. Are Spansion products RoHS compliant?
4. Does Spansion have a definition for halogen-free products?
5. Are Spansion products low halogen?
6. Do Spansion low halogen products need a special reflow profile?
7. Are products from Spansion regulated by EU REACH?
8. Which Spansion products meet the definition of low halogen?
9. Does Spansion use PFOA or PFOS compounds?
10. Do Spansion products contain PVC (Poly Vinyl Chloride)?
11. Does Spansion have a roadmap for eliminating other substances?

Non-Pb (Plumbium, or lead) Flash Memory Products

Spansion is continually striving to meet the ever-changing requirements and needs of its customers. As a result, new additions are constantly being made to product offerings.

Please check with the local Spansion sales/marketing representative for the latest updates on any material content related question.

1. What is your definition for "Non-Pb" packages?
2. Which types of standard packages are available with Non-Pb solder finish? (100% RoHS compliant)
3. Are material data sheets available for your Non-Pb products?
4. What is the maximum reflow temperature for your Non-Pb memory packages?
5. What Non-Pb finishes have been chosen for Spansion Flash memory products?
6. Why do Spansion Cu leadframe products use matte Sn in spite of concerns regarding whisker growth?
7. How does Spansion define backward and forward compatibility between SnPb and Non-Pb reflow processes?
8. Are Spansion Non-Pb Flash memory products backward compatible? (In other words, can Non-Pb parts be used as a drop-in replacement to the existing Pb-based products in a Pb-based process?)
9. What are the characteristics of the Non-Pb plating selected for use on leadframe products?
10. Are Non-Pb Spansion Flash memory products compliant with the EU RoHS?
11. Are quality and reliability standards for packages with Non-Pb solder finishes different from the standards for SnPb solder finishes?
12. How will RoHS compliant packages be identified?
13. Will Spansion incorporate JESD97 specification in marking external packing as "Non-Pb?"
14. How do OPNs (Ordering Part Numbers) for SnPb and Non-Pb solder finishes differ?
15. What changes in the assembly processes are necessary when using Non-Pb solder finishes?

Green Flash Memory Products

1. Is there a standard definition of "green?"

No, there is no standard definition for "green", other than for a certain color (light wavelengths between 495–570 nm). ‘Green product’ is a marketing term used by some groups and companies to indicate whether or not materials they have targeted are present in their products.

Since different criteria are used to differentiate customer products, Spansion cannot declare in advance whether or not Spansion products meet another group's definition of green.

We report all of the materials present in our products, and list these reports by package type (click here).

2. Are Spansion products "Energy Star" compliant?

Spansion flash memory products are not end-customer products and so are not eligible for EPA's energy star award. But they are low-power, energy efficient flash memory devices, some of which are incorporated into our different customers' "Energy Star" products.

3. Are Spansion products RoHS compliant?

All Pb-free Spansion Flash memory products are compliant with RoHS.

Spansion Flash memory products with SnPb solder are not fully RoHS compliant - they do not contain mercury, hexavalent chromium, cadmium, PBBs, or PBDEs, but they do contain lead. Products with this compliance profile are sometimes referred to as 5/6 RoHS compliant.

4. Does Spansion have a definition for halogen-free products?

Halogens are a group of chemical elements which includes:
  • Fluorine
  • Chlorine
  • Bromine
  • Iodine
  • Astatine

There is not yet a regulatory or industry standard defining the term “halogen-free”.

Spansion is aware that the IPC 4-33 Halogen-Free Subcommittee is working on a draft which names this industry initiative “low halogen” rather than “halogen-free” as de minimus quantities of chlorine and bromine are allowed, and fluorine and iodine concentrations are not restricted.

For Spansion’s definition, all homogeneous materials must meet the substance restrictions set forth in Table 2 in order to be classified as low halogen (previously referred to as “halogen-free”).

5. Are Spansion products low halogen?

Current Spansion Flash memory in leadframe (PDIP, PLCC, PQFP, SOIC, SSOP, and TSOP) packages are “low halogen."

Most FBGA, and MCP packages do not meet the definition of "low halogen" due to the presence of brominated epoxy resins in substrates made using Mitsubishi Gas Chemical CCL-HL 832HS material. Spansion expects to qualify low halogen FBGA and MCP packages for general sales beginning in Q3 2008. These substrates will use Mitsubishi Gas Chemical CCL-HL 832HX type A.

Should you find you need low halogen substrate products before that time, please contact Spansion.

6. Do Spansion low halogen products need a special reflow profile?

No they do not. The reliability of Spansion “low halogen” memory products is identical to that of standard (halogen containing) parts.

7. Are products from Spansion regulated by EU REACH?

No.

The EU REACH Directive 1999/45/EC regulates chemical substances, including those used to manufacture articles (products), or in articles that may release substances.

It is Spansion’s view that since Spansion products are not fabricated within the EU, there is not any reason to register process chemicals under REACH. Manufacturers of semiconductors within the EU will be required to register process chemicals.

Since flash memory products do not emit any substances, there is no requirement to register the materials our products are made from. We do not expect EU manufacturers of semiconductors will register their products either.

Spansion will continue to monitor REACH, RoHS, WEEE, and other regulations worldwide.

8. Which Spansion products meet the definition of low halogen?

By our own definition above, all of Spansion’s current leadframe products (PDIP, PLCC, PQFP, SOIC, SSOP, and TSOP packages) are low halogen. Some of the Fujitsu legacy parts are not.

FBGA, and MCP packages normally do not meet the definition of "low halogen" due to the presence of brominated epoxy resins in substrates of Mitsubishi Gas Chemical CCL-HL 832HS.

Spansion expects to qualify low halogen FBGA and MCP packages for production beginning in Q3 2008. These substrates will use Mitsubishi Gas Chemical CCL-HL 832HX type A. We expect these substrates to be of interest primarily to our wireless customers. The original substrate material will remain in production.

Please note our definition for low halogen does not include fluorine. Substrate products may use a small amount of fluoropolymers in die attach film. For more information see the individual package MDDS, which is posted in the packaging handbook on Spansion’s website.

9. Does Spansion use PFOA or PFOS compounds?

These compounds play important roles in the photo resists and anti-reflective coatings used in the semiconductor industry for manufacture of integrated circuit die. At this time, regulatory exemptions will allow us to continue using these materials in critical applications until technically viable alternatives are available.

Spansion recognizes the potential environmental and human health impacts associated with this category of chemicals, and is actively working with our suppliers to identify PFOS- and PFOA-free alternatives. In the interim, Spansion is actively minimizing the use of these materials in its worldwide operations, and is working with trade associations to eliminate or reduce their impact to the environment.

10. Do Spansion products contain PVC (Poly Vinyl Chloride)?

No.

Some of the packing materials used to ship Spansion products contain PVC.

Specifically; Products in TSOP packages are available shipped in PVC tubes. Customers may choose to receive their TSOPs packed in trays or on reels (neither of which contain PVC) instead of in tubes.

11. Does Spansion have a roadmap for eliminating other substances?

No other substances are currently targeted for elimination.

Chapter 3 in our packaging handbook on material declarations includes a declaration of substances listed in the JIG (Joint Industry Guide) that are not contained in Spansion products.

If a material is not listed on our material declaration, it is probably not present, although we have not conducted comprehensive testing in order to make negative declarations. If you are concerned about a material that is not listed, please ask your sales representative about it so they can forward your question within our organization.

You may wish to provide a copy of your material guidelines or specifications for review before ordering parts.

Non-Pb (Plumbium, or lead) Flash Memory Products

1. What is your definition for "Non-Pb" packages?

Spansion Non-Pb Flash memory packages employ a solder finish (and other materials) with a Pb concentration less than 0.1 wt% (percent by weight). This definition meets the limits of the EU for Directive 2002/95/EC on the Restriction of certain Hazardous Substances in electrical and electronic equipment (RoHS). It is also the definition most commonly used by our customers.

2. Which types of standard packages are available with Non-Pb solder finish? (100% RoHS compliant)

All Spansion products are available with Non-Pb solder finishes. Parts with Non-Pb solder finishes and parts with SnPb (Tin-Lead) solder finishes are differentiated by the part number. More information is available under FAQ #14.

3. Are material data sheets available for your Non-Pb products?

Spansion publishes material data sheets for both Non-Pb and SnPb products. Click here to access this data.

4. What is the maximum reflow temperature for your Non-Pb memory packages?

All Spansion "Non-Pb process compliant" and "Non-Pb" memory products are qualified at JEDEC level 3 and JEITA Rank 'E' with a maximum reflow temperature of 260°C +0/-5 (260°C maximum) and a maximum of 3 times reflow.

Click here for the reflow conditions used for determination of package moisture sensitivity level and a schematic of the reflow profile.

Note: This profile is used for internal qualification of packages and only shows the times and temperatures our packages are guaranteed to withstand. This should not be construed as a recommended profile for board mounting of our parts. Customers should optimize their board mounting reflow profiles per their board design, solder paste and flux selection, etc.

5. What Non-Pb finishes have been chosen for Spansion Flash memory products?

Cu (Copper) leadframe packages including: PDIP, PLCC, PQFP, SOIC, SSOP, and TSOP; use 100% matte-Sn (Tin) plating.

Laminate packages including both single-die FBGAs and multi-die MCPs use solder spheres composed of SAC 305 (96.5% weight Tin, 3.0% Silver, and 0.5% Copper) in standard packages.

SAC 105 (98.5% weight Tin, 1.0% Silver, and 0.5% Copper) or SAC 125 (98.25% weight Tin, 1.2% Silver, 0.5% Copper, and 0.05% Nickel) are used for special applications.

Click here for more details.

6. Why do Spansion Cu leadframe products use matte Sn in spite of concerns regarding whisker growth?

Matte Sn plating has been chosen for Cu leadframe Spansion Non-Pb memory products for the following reasons:

• Matte Sn is compatible with existing SnPb and Non-Pb board assembly processes.
• Matte Sn has a higher melting point than other Non-Pb alternatives, which makes it acceptable for automotive and high temperature applications.

To date, no whisker growth has been observed for the matte Sn plating chemistry qualified for Spansion memory products. Refer to the linked 100% Sn Whisker Growth Study for further details.

7. How does Spansion define backward and forward compatibility between SnPb and Non-Pb reflow processes?

By backward compatibility, we mean to indicate whether a Spansion Non-Pb product is capable of being processed using a SnPb solder process and reflow temperature profile.

By forward compatibility, we mean to indicate whether the SnPb product is capable of being processed using a new Non-Pb solder reflow process.

Click here for an illustration of these definitions.

8. Are Spansion Non-Pb Flash memory products backward compatible? (In other words, can Non-Pb parts be used as a drop-in replacement to the existing Pb-based products in a Pb-based process?)

Spansion Non-Pb parts are backward compatible. However, in some cases, minor adjustments in the peak reflow temperature may be required to obtain good quality solder joints.

Spansion Non-Pb leadframe based packages can be considered as "drop-in replacements," i.e., can be used in place of their SnPb counterparts with the existing SnPb assembly process.

Spansion laminate packages with Non-Pb solder finishes, on the other hand, might require minor adjustments in the reflow profile when being used as replacements to their SnPb counterparts.

9. What are the characteristics of the Non-Pb plating selected for use on leadframe products?

Leadframe products use the following finishes:

Note: Spansion’s leadframe packages are listed under FAQ #5.

10. Are Non-Pb Spansion Flash memory products compliant with the EU RoHS?

Yes. Spansion Flash memory products with Non-Pb solder finishes contain less than regulated concentrations of Cadmium (Cd), Mercury (Hg), Hexavalent Chromium (Cr6+), Lead (Pb) [as detailed under FAQ #1], PolyBrominated Biphenyls (PBB), and PolyBrominated Diphenyl Ether (PBDE).

11. Are quality and reliability standards for packages with Non-Pb solder finishes different from the standards for SnPb solder finishes?

No. Quality and reliability standards remain the same.

12. How will RoHS compliant packages be identified?

Package Markings:

• Packages using Non-Pb solder finish have new OPNs. Customers can use the new OPN when ordering Non-Pb products.

External Packing:

• Packages using Non-Pb solder finish: External markings will correspond to the new OPNs. In addition, a Non-Pb symbol will be marked per JESD97. In Q2 2007 Spansion also added an RoHS marking.

13. Will Spansion incorporate JESD97 specification in marking external packing as "Non-Pb?"

Since Q1 2005, Spansion marks second level packaging (inner cartons, dry pack bags, and so forth) with the following symbol:

In Q2 2007, Spansion added the following symbol:

RoHS

Since Spansion does not sell product to consumers, packaging is not marked for China RoHS, although a declaration is posted on our webpage here.

Other markings may be added later as standards for marking Non-Pb components are harmonized and consolidated.

14. How do OPNs (Ordering Part Numbers) for SnPb and Non-Pb solder finishes differ?

Note: Information regarding OPNs for legacy products is informational only, not all legacy products will be available with Non-Pb solder finishes.

Spansion OPNs use the 13th digit of the OPN to differentiate between SnPb and Non-Pb solder finishes. SnPb solder finishes are coded with an "A". Non-Pb solder finishes are coded with an "F" or a “J”.

AMD Legacy Products change the OPN by having a new temperature codes after the speed grade.

Fujitsu Semiconductor Ltd Legacy Products have an "E1" at the end of the OPN to designate Non-Pb.

15. What changes in the assembly processes are necessary when using Non-Pb solder finishes?

Changes to solder paste, type of flux and reflow profile may be required to achieve optimal quality and reliability solder joints.

Check with your paste/flux provider for processes/profiles based on your specific application.