RoHS/Lead-Free Compliance and Definitions

Our Definition of Lead-free Packages

Spansion® lead-free memory packages use solder and other materials that have a maximum of 0.1% Pb (percent by weight). This is the definition the EU for Directive 2002/95/EC on the restriction of certain hazardous substances in electrical and electronic equipment (RoHS).

It is also the maximum allowable concentration for lead found in EU Directive 2000/53/EC for vehicle end of life, and it is the definition most commonly being provided by our customers.

Lead-free Process Compliant Standard Packages

Spansion lead-free process compliant memory packages use standard SnPb terminal finish and are able to withstand reflow temperatures required for lead-free assemblies.

Leadframe Packages:

• PQFP, SOIC, SSOP, TSOP, PDIP, and PLCC leadframe packages are available as lead-free process compliant.

Laminate (FBGA) Packages:

• Spansion FBGAs, both single chip and multiple chip packages (MCP), are compliant with the higher reflow temperatures used for lead-free assembly.