Manufacturing Fabrication Facilities (Fabs)

Spansion® maintains world-class manufacturing facilities, known as "fabs," across North America and Asia. In every Spansion facility, we use advanced decision-making and control technologies to optimize, integrate and automate material processing at nearly every stage in the manufacturing process. We have one research and development fab, the Submicron Development Center, and three production fabs. Additionally, we have agreements in place with leading-edge foundries.

Submicron Development Center (SDC)

The Submicron Development Center (SDC) is located in Sunnyvale, California and supports advanced process technology, research and development efforts utilizing some of the most advanced in semiconductor manufacturing equipment. In addition, the SDC works closely with primary manufacturing facilities to help ensure smooth transfer of process technology into volume production.

Fab 25

Fab 25 is a major presence on the southeast side of Austin, Texas. With more than 120,000 square feet of Level 1 clean room space, Fab 25 manufactures Spansion’s state-of-the-art MirrorBit® Flash memory solutions on 65nm and 90nm process technology and MirrorBit® Quad memory solutions on 90nm, with plans to add 65nm by the end of 2007.

Spansion SP1

SP1 is the first fab built by Spansion as an independent company and is the industry’s first 300mm NOR Flash Memory Facility. SP1 is co-located and shares certain resources with Spansion’s other facility in Aizu, JV3.

By leveraging this next-generation facility, and cost advantage and technology advantages of MirrorBit technology, Spansion can deliver on our promise to bring more value to customers by producing differentiated products and redefine the Flash memory industry. Spansion plans to begin producing 65nm MirrorBit® products by the end of 2007, followed by 45nm.

Spansion JV3

JV3, also located in Aizu-Wakamatsu, Japan, is Spansion’s primary producer of 110nm MirrorBit devices on internal aluminum metal layer technology. Other current and legacy devices can also be manufactured there. Built during the joint venture between AMD and Fujitsu, this fab has approximately 118,000 square feet of Level 1 clean room space.