Spansion® Assembly, Test, Mark and Pack Facilities

Spansion's Final Manufacturing Operations (FMO) is dedicated to providing complete Flash memory packaging solutions to customers.

In addition to package technology R&D, package design, and package process engineering, FMO conducts reliability testing, performs Assembly, Test, Mark and Pack manufacturing, and ships to customers.

Spansion FMO operates four state-of-the-art facilities located in Asia, all equipped with the latest packaging and assembly process equipment:

Bangkok (Thailand)

With nearly 1,300 employees, the Thailand plant is located in Nonthaburi, near the city center and airport. One of the most modern of its kind in Southeast Asia, the manufacturing facility is certified to ISO 9001:2000 and ISO/TS 16949:2002 as well as ISO 14001 and OHSAS 18001 standards.

Our Bangkok facility includes an Employee Development Center, where employees are involved with Total Continuous Process Improvement (TCPI²) and Innovation programs such as Statistical Process Control (SPC) monitors that ensure real-time process control. Operations at the plant include:

• High-volume manufacturing of MCP, FBGA, TSOP, PLCC, and SOIC packages
• Spansion Assembly, Test, Mark and Pack Facilities
• Material planning
• Customer support

Penang (Malaysia)

The Penang plant has more than 500 employees and occupies four two buildings located in the hub of a high-tech electronic and electrical center near the international airport. Penang is certified to ISO 9001:2000; ISO/TS 16949:2002; ISO 14001; and OHSAS 18001 standards. Operations at Penang include:

• Assembly of advanced Multi-Chip Products (MCPs) in ceramic and plastic packages using wire bond and the C4 flip chip process
• Spansion Assembly, Test, Mark and Pack Facilities
• Known Good Die (KGD) testing and packing
• Customer support

Kuala Lumpur (Malaysia)

Approximately 1000 employees, the Kuala Lumpur plant is located 40km west of the city Kuala Lumpur and within 40 minutes of the Kuala Lumpur International Airport.

The assembly, test, mark and pack facility produces Spansion Flash memory products in leaded package form. It is certified to ISO 9001:2000 and ISO/TS 16949:2002 as well as ISO 14001 and OHSAS 18001. Operations at Kuala Lumpur include:

• High-volume manufacturing of TSOP, PLCC, SOIC packages
• Spansion Assembly, Test, Mark and Pack Facilities
• Customer support

Suzhou (China)

Located in the Suzhou Industrial Park, the Suzhou facility has been operating in China since 1998. With more than 900 employees, Suzhou is one of the largest foreign employers in the park. The facility is certified to ISO 9001:2000 and ISO/TS 16949:2002 as well as ISO 14001 and OHSAS 18001 standards.

Spansion recently invested in a new MCP development center in Suzhou. The center develops next-generation multi-chip product technology, with the goal of turning Flash silicon into MCP samples in one week. Operations at Spansion Suzhou include:

• MCP package development
• High-volume manufacturing of MCP, FBGA, and TSOP packages
• Spansion Assembly, Test, Mark and Pack Facilities
• Customer support