S70WS512N00

Same-Die Stacked Multi-Chip Product (MCP)
512 Megabit (32M x 16 bit) CMOS
1.8 Volt-only Simultaneous Read/Write,
Burst-mode Flash Memory

The S70WS512N Series is a product line of stacked Multi-Chip Product (MCP) packages and consists of two S29WS-N flash memory die.

Device Architecture
Density	512Mb
Voltage	1.8 Volts
Interface	Burst-mode Multi-chip product Simultaneous Read/Write
Process Technology	110 nm MirrorBit™ technology
Bus Width	x16
Sector Type	Boot Sector
Basic Ordering Options
Temperature Range	-25°C to +85°C

Downloads	Document code	Last updated
s70ws512n00_00_a0_e.pdf	s70ws512n00_00_a0_e	Mar. 17, 2005