Handset Manufacturers

Spansion® Flash Memory Solutions for Handset Manufacturers

Spansion provides a scalable platform for code execution and data storage needs that delivers outstanding design flexibility with the least amount of development effort and cost.

Scalable Platform Meets a Wide Range of Consumer Needs

Spansion® technology enables multiple phone models that can be based on one scalable platform— whether developing basic, feature, high-end, or smart phones. Spansion MirrorBit® NOR solutions enable code to be executed directly out of Flash memory, avoiding the costly use of DRAM for shadowing.  On the low-end, MirrorBit NOR products provide the right densities, execute-in-place (XIP) capabilities and reliability needed to provide a single-chip solution for code execution and data storage.  As data storage needs grow, Spansion MirrorBit® ORNAND™ products provide an optimized data storage solution.  This platform approach enables handset designers to easily add or subtract features, provide a range of functionality and price points, and leverage their hardware and software investment across multiple phone models for faster time-to-market and lower design costs.

Ensure Reliable, High Performance Code Execution

Spansion MirrorBit solutions provide 100 percent good blocks, ensuring that phones remain operable without costly and complex ECC schemes.  Basic services require the highest standard of reliability and as next-generation mobile video, gaming, and television services emerge, handset performance and reliability are essential to customer adoption. Spansion Flash memory solutions are proven to deliver fast system boot-up, reliable code execution and the latest multimedia content.

Accelerate Time-to-Market

The ability to add MirrorBit ORNAND solutions to the MirrorBit NOR platform allows developers to use common software and shorten development time. A common platform also simplifies ongoing support. For greater flexibility in selecting the right density level, form factor and power requirements, advanced packaging availability includes:

1. Multi-chip package (MCP) - combines high-performance Spansion Flash memory and other high-quality memory devices into a single, small, and consistent footprint
2. Package-on-package (PoP) - the latest packaging innovation designed to vertically combine discrete logic and memory Ball Grid Array (BGA) packages.

Recommended Spansion® Flash Memory

Basic Phones
	High Performance		Value
MirrorBit® NOR	NS	64 Mb 32 Mb	GL	32 Mb 16Mb
	PL	64 Mb 32 Mb	NS	32 Mb 16Mb
MirrorBit ORNAND™	N/A		N/A

Feature Phones
	High Performance		Value
MirrorBit NOR	WS	128 Mb 64 Mb	GL	32 Mb 16Mb
	NS	128 Mb 64 Mb	NS	32 Mb 16Mb
	PL	128 Mb 64 Mb	PL	32 Mb
MirrorBit ORNAND	N/A		N/A

High-End and Smart Phones
	High Performance		Value
MirrorBit NOR	WS	512 Mb 256 Mb 128 Mb	GL	512 Mb 256 Mb 128 Mb
	NS	512 Mb 256 Mb 128 Mb	PL	256 Mb 128 Mb
MirrorBit ORNAND	MS	1G 512 Mb	ML	2G 1G 512 Mb 256 Mb

For more information about Spansion’s portfolio of Flash memory products for wireless applications, please call your local sales representative